智能穿戴

智能加热服

伦茨科技的集成电路和参考设计为您提供低功耗蓝牙、省料设计的智能加热服解决方案的帮助，通过ST17H66 BLE 5.2蓝牙无线堆栈配对连接智能手机APP，实现检测外界温度自适应加热、调节加热时间、温度记录、剩余电量等功能。此方案功耗极低且易于生产。

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Features

Develop Kit

Applicable Chips

Latest Dynamic

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Features

1、支持自适应加热模式；

2、支持iOS/Android双系统；

3、支持智能定时启停；

ST17Hxx

Develop Kit

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Applicable Chips

芯片：ST17H66

描述：Bluetooth 5.2、BLE、Bluetooth Mesh

CPU：高性能低功耗32位处理器

存储器：64KB SRAM,all programmable retention in sleep mode

支持的频段：2.4 GHz

支持的协议：Bluetooth 5.2

灵敏度：-97dBm@BLE 1Mbps data rate

发射功率：+10dBm

接收电流：8mA

发射电流：8.6mA

封装：TSSOP16

开发套件：ST17Hxx开发套件

Latest Dynamic

Company News 2020-09-15

ST17H66蓝牙BLE5.2芯片，物联网芯片的首选

Company News 2020-12-25

智能加热服方案

Company News 2021-02-01

伦茨科技最新16脚蓝牙BLE5.2芯片-ST17H66

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