BLE MESH解决方案
LENZE 蓝牙MESH 是一种用于建立多对多(m:m)设备传输、网络覆盖及低功耗蓝牙的通信能力,采用树状拓扑结构,其节点具有 ST17H 系列 SoC 的 SIG-MESH 多种特性。
Learn moreBLE MESH解决方案
LENZE 蓝牙MESH 是一种用于建立多对多(m:m)设备传输、网络覆盖及低功耗蓝牙的通信能力,采用树状拓扑结构,其节点具有 ST17H 系列 SoC 的 SIG-MESH 多种特性。
Learn moreST17H66
SoC ultra-low power Bluetooth wireless communication chip with 32-bit CPU, 64K retention SRAM, 512/256KB Flash, 96KB ROM, 256bit memory
ST17H65
Ultra-low power Bluetooth wireless communication chip for IoT with 32-bit ARM Cortex™-M0 CPU with 138K SRAM/Retention SRAM
LC6976D8
Equipped with 32-bit DSP supporting hardware Float Point, 160MHz processor, Bluetooth wireless audio communication chip supporting AAC, ENC